RF Manufacturing Solutions
Bypass our design team and head straight into production and test.
When your circuits are past the design stage and are ready to be put into production and test, KCB can leverage the same comprehensive suite of capabilities we use to realize our own product lines to manufacture, rf test, and screen your products. We have the necessary resources in place to manage procurement, handling, storage and delivery of product. KCB is also uniquely positioned to support the full range of DC and RF testing necessary to ensure that every device is 100 percent compliant to your specifications. Contact us today about your electronic manufacturing services needs.
To learn about our Product Realization process, please contact us.
Weightless, Void Free
Our innovative “weightless” gold/tin eutectic die attach method allows us to attach single or multiple die simultaneously while ensuring ultra-critical void free attachment.
Specifically put in place to address the growing size of MMIC chips, our process has been proven on a variety of technologies via X-ray imaging for military and space applications. KCB’s experience ranges from applications that require eutectic attachment in sealed packages to mounting GaN devices on an open carrier.